September, 2006 - CPI Passive Cooling™ Solutions, Achieving Innovative Thermal Management | Chatsworth Products

CPI Passive Cooling Solutions
Achieving Innovative Thermal Management



WESTLAKE VILLAGE, Calif. - September 2006- Chatsworth Products, Inc. (CPI), a leading manufacturer of systems designed to organize, store and secure IT infrastructure equipment offers new CPI Passive Cooling™ Solutions to solve thermal management challenges.

Passive cooling is an innovative technique that allows you to control the flow of air through cabinet spaces. CPI Passive Cooling™ Solutions provide 2-20+ kW of cooling without the use of uncertain supplemental liquid or active cooling systems. This safe solution allows customers to reclaim control over airflow so that cool air can be directed where it is needed, eliminating bypass and re-circulation of hot exhaust air and the formation of hot spots.

CPI Passive Cooling Solutions provide flexibility, scalability, Tier IV capabilities and the ability to minimize total cost of ownership. These solutions allow uncomplicated moves, adds and changes while also permitting customers to configure a solution designed to meet their specific needs. Adaptable for increasing density requirements, CPI Passive Cooling Solutions accomplish high heat density cooling while achieving advanced thermal control with zero points of failure. In addition, CPI Passive Cooling Solutions maximize CRAC effectiveness, decrease ongoing maintenance costs and reduce the risks and costs associated with supplemental liquid or active cooling systems.

  

CPI Passive Cooling Solutions
CPI Passive     Cooling™Solutions   

To maximize effective cooling capacity, it is important to manage airflow through, over and around equipment cabinets. CPI Passive Cooling Solutions, available with the TeraFrame™ Cabinet System help achieve the ultimate thermal management solution by reclaiming airflow control and improving cooling effectiveness in the data center with low, medium or high heat density CPI Passive Cooling Solutions.

CPI's low heat density solution achieves 2-4 kW of cooling by eliminating hot air recycling through the cabinet. Begin by blocking airflow through open rack spaces with CPI's Snap-In Filler Panels, diminishing hot air re-circulation to the font of the cabinet. Close off space where air can go around the sides, top and bottom of equipment mounting spaces with the Air Dam Kit. Effectively this will create a front-to-rear barrier to airflow and will lower the temperature of air entering the top half of the cabinet because hot air is not re-circulated through the cabinet. Air still re-circulates over the cabinet, but now travels in a one-way direction through equipment.

   Low Density   
Low Heat Density
Solution
 

Increasing the amount of cold air entering the cabinet will help to attain 4-7 kW of cooling, therefore providing a medium heat density solution. To increase the amount of cold air available to each cabinet, seal cable holes with the KoldLok® Raised Floor Grommet and block airflow through open rack spaces with Snap-In Filler Panels. Use CPI's patent pending Internal Air Duct instead of the Air Dam Kit to deliver additional cold air to the top half of the cabinet. This cold air will lower the temperature of air directed to the upper portion of the cabinet, thereby reducing the negative effects of hot air traveling over the cabinet into the cold aisle.

MD
Medium Heat Density Solution      

Overcome a high heat density solution by isolating hot air from the room to accomplish 7-20+ kW of cooling. Use CPI's patent pending Vertical Exhaust Duct System (includes; Vertical Exhaust Duct, Server Top Panel, Airflow Director and Rear Door Sealing Kit) with the Air Dam Kit, KoldLok Raised Floor Grommet and Snap-In Filler Panels to create a ducted exhaust cabinet. Hot air will be isolated from the room and returned to the primary cooling system through the drop ceiling plenum or ducted return positioned high above the cabinet. Because hot air is isolated in the duct, you can place vented access floor tiles in the hot aisle to deliver additional cold air to equipment. The resulting lower room temperature eliminates the need for supplemental liquid or active cooling systems.

High Density
High Heat Density
Solution
 

 

TeraFrme 

Snap-In Filler Panels 

Air Dam Kit 

Internal Air Duct 

KoldLok 

VEDS 

TeraFrame™ Cabinet
System
 

Snap-In Filler
Panels
 

Air Dam Kit 

 Internal Air Duct          

KoldLok® Raised Floor
Grommet
 

Vertical Exhaust Duct
System
 


Use CPI's Product Configurator at www.chatsworth.com/configurator to customize your TeraFrame Cabinet System with CPI Passive Cooling Solutions and achieve the ultimate data center thermal solution. Once you have configured your solution receive a BOM, rendered drawings and a selection of global distributors. For additional information about CPI Passive Cooling Solutions or other CPI products visit www.chatsworth.com/passivecooling.
 

About Chatsworth Products 
At Chatsworth Products (CPI), it is our mission to address today’s critical IT infrastructure needs with products and services that protect your ever-growing investment in information and communication technology. We act as your business partner and are uniquely prepared to respond to your specific requirements with global availability and rapid product customization that will give you a competitive advantage. At CPI, our passion works for you. With over two decades of engineering innovative IT physical layer solutions for the Fortune 500 and multinational corporations, CPI can respond to your business requirements with unequaled application expertise, customer service and technical support, as well as a global network of industry-leading distributors. Headquartered in the United States, CPI operates from multiple sites worldwide, including offices in Mexico, Canada, China, the United Arab Emirates and the United Kingdom. CPI’s manufacturing facilities are located in the United States, Asia and Europe.

CPI is listed with the General Services Administration (GSA) under Federal Supply Schedule IT 70. Products are also available through GSA Advantage and through Government Wide Acquisition Contracts (GWACs), including GSA Connections and NITAAC-ECS III (www.chatsworth.com/gov).

More Information
www.chatsworth.com
info@chatsworth.com
800-834-4969

Media Contact
Raissa Carey
Public Relations 
rcarey@chatsworth.com
512-591-9525

©2017 Chatsworth Products, Inc. All rights reserved. Chatsworth Products, Clik-Nut, CPI, CPI Passive Cooling, CUBE-iT PLUS, eConnect, Evolution, GlobalFrame, MegaFrame, OnTrac, QuadraRack, RMR, Saf-T-Grip, SeismicFrame, SlimFrame, TeraFrame and Velocity are federally registered trademarks of Chatsworth Products. EuroFrame, Motive, Secure Array and Simply Efficient are trademarks of Chatsworth Products. All other trademarks belong to their respective companies. 
11/21/2017 11:24:10 AM