CPI Passive Cooling® Solutions is the most cost effective and cooling effective thermal management solution on the market. It provides superior equipment cooling performance while reducing your data center cooling energy costs. By offering innovative airflow management techniques, CPI Passive Cooling Solutions allow you to maximize your cooling efficiencies without the need for additional CRAC units, in-row air conditioners or risky liquid cooling solutions. From small applications with heat loads of 2 kW per cabinet to large data center applications with heat densities up to 30 kW, CPI Passive Cooling Solutions provide advanced thermal management with zero points of failure, thus delivering a Tier IV solution.
The passive cooling technology found with CPI’s TeraFrame® Family of Cabinets and T-Series SteelFrame Cabinet helps reduce data center operating costs, maximizes cooling unit efficiencies and minimizes your environmental impact, making CPI Passive Cooling Solutions the Simply Efficient™ choice.
- Lowers construction costs relative to active cooling solutions ... no additional power or plumbing requirements necessary
- Reduces operational costs by completely isolating hot exhaust air from cool supply air, maximizing cooling unit efficiencies
- Reduces energy consumption by providing 100% HVAC utilization of cool supply air
- Reduces cooling costs up to 40%, and save 90% on energy costs when combined with other technologies like heat exchangers and economizers.
- Allows for higher Delta T’s between the data center cooling air and exhaust air, which maximizes cooling unit efficiencies
- Allows for raised set points (thermostat setting) on cooling units, lowering energy consumption and costs
- Permits for higher heat densities/power densities based on maximizing cooling efficiency
- Allows for Tier IV operation because there are no moving parts that require redundant systems
- Blocks by-pass airflow around equipment, reducing wasted cooling capacity
- Eliminates dependence on close proximity of perforated floor tiles to cabinets by creating a consistent air temperature throughout the room
- Permits chilled water temperatures to be increased, providing means for more economizer days while using the same space
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- Mitigating problem cooling areas/hot spots
- Upgrading equipment to higher heat/power densities while using the same space
- Converting an existing space/room/building into a data center (brown field)
- Designing and building a new data center (green field)
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To learn more about CPI Passive Cooling Solutions, the Simply Efficient Choice, download the following: White Papers - Biggest Opportunity for Data Center Energy Savings
- CPI Passive Cooling® Solutions: A Path to Higher Density and Lower Cost
- CPI: Ducted Exhaust Cabinet - Managing Exhaust Ariflow Behond Hot Aisle/Cold Aisle
- Intel: Air-Cooled High Performance Data Centers: Case Study and Best Methods
- Intel: Reducing Data Center Energy Consumption with Wet Side Economizers
- Pacific Gas & Electric: High Performance Data Centers: A Design Guidelines Sourcebook
Articles - CI&M – Isolation Strategies for Air Cooling High Density Data Centers
- Mission Critical – Data Center Cooling Techniques
- Business Management – Hot Air Isolation Cools High Density Data Centers
- Communication News – How to Decrease Data Center Cooling Cost up to 40%
Documents - CPI Passive Cooling Application Sheet
- Thermal Management Solutions Brochure
- TeraFrame Family of Cabinets Brochure
- CFD Airflow Analysis by Fluent®
- CPI Green Statement
Documents for CPI's N-Series TeraFrame® Network Cabinet (for side-to-side airflow and high-density cable management) - Supporting Cisco Switches In Hot Aisle/Cold Aisle Data Centers
- Thermal News Article: How to Properly Manage Network Switch Equipment Cabinet Spaces
- N-Series TeraFrame Network Cabinet Solutions Brochure: CISCO® Compatible
Videos - "An Intel Retrofit Data Center" by Intel, highlighting CPI's Ducted Cabinet Solution
- "Intel Economizer Proof of Concept" by Intel
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CPI Cabinet That Support CPI Passive Cooling Solutions: The F-Series TeraFrame delivers unprecedented cooling performance in high-density computing applications when deployed with these options: - Vertical Exhaust Duct
- Airflow Director
- Snap-In Filler Panels
- Air Dam Kit
- Solid Rear Door with Seal
Vertical Exhaust DuctThese products create a one-way flow of air through the equipment that results in consistently cold air in both the top and bottom of the cabinet. By closing all open spaces, air can no longer recirculate within the cabinet. Cold air enters the cabinet through a perforated front door (or no door), flows through the equipment and is expelled into the drop ceiling via the Vertical Exhaust Duct. Advantages include: - Supports heat loads of 2-30 kW
- Prevents hot and cold air from mixing within the cabinet
- Prevents hot exhaust air from recirculating over or around cabinet and entering front of equipment
- Delivers uniformly cold intake air temperatures to all equipment when fully implemented across data center
- Maximizes efficiency of air conditioning
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 The N-Series TeraFrame Network Cabinet is designed to manage side-to-side airflow in a hot aisle/cold aisle layout with a unique Network Switch Exhaust Duct that converts side-to-side airflow into a front-to-rear airflow pattern. This isolates and re-directs hot air out the back of the cabinet and into the hot aisle, minimizing hot air re-circulation. Thermal choices include:
The N-Series TeraFrame Network Cabinet is designed to manage side-to-side airflow in a hot aisle/cold aisle layout with a unique Network Switch Exhaust Duct that converts side-to-side airflow into a front-to-rear airflow pattern. This isolates and re-directs hot air out the back of the cabinet and into the hot aisle, minimizing hot air re-circulation. Thermal choices include:- Network Switch Exhaust Duct
- Network Switch Exhaust Duct Panel
- Snap-In Filler Panels
- Solid Rear Door
One Network Switch Exhaust Duct supports exhaust from two network switches, providing the freedom to organize and move equipment as needed. Serving as a complete and cost effective solution for high-density applications, this solution allows customers to maximize energy efficiency without adding any active components that may increase maintenance cost, compromise redundancy and decrease total cost of ownership. Advantages include: Removes hot exhaust air - designed to meet third party specifications for Cisco 6500 and 9500 switches Maximizes energy efficiency Supports hot aisle/cold aisle layout
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The T-Series SteelFrame Cabinet delivers unprecedented cooling performance in high-density computing applications when deployed with these options:
- Vertical Exhaust Duct
- Airflow Director
- Snap-In Filler Panels
- Air Dam Kit
- Solid Rear Door with Seal
These products create a one-way flow of air through the equipment that results in consistently cold air in both the top and bottom of the cabinet. By closing all open spaces, air can no longer recirculate within the cabinet. Cold air enters the cabinet through a perforated front door (or no door), flows through the equipment and is expelled into the drop ceiling via the Vertical Exhaust Duct. Advantages include: - Supports high heat densities
- Prevents hot and cold air from mixing within the cabinet
- Prevents hot exhaust air from recirculating over or around cabinet and entering front of equipment
- Delivers uniformly cold intake air temperatures to all equipment when fully implemented across data center
- Maximizes efficiency of air conditioning
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