CPI Passive Cooling® Solutions is the most cost effective and cooling effective thermal management solution on the market. It provides superior equipment cooling performance while reducing your data center cooling energy costs. By offering innovative airflow management techniques, CPI Passive Cooling Solutions allow you to maximize your cooling efficiencies without the need for additional CRAC units, in-row air conditioners or risky liquid cooling solutions. From small applications with heat loads of 2 kW per cabinet to large data center applications with heat densities up to 30 kW, CPI Passive Cooling Solutions provide advanced thermal management with zero points of failure, thus delivering a Tier IV solution.
- Lowers construction costs relative to active cooling solutions
- Reduces data center cooling costs up to 90%, and saves up to 40% on total data center energy costs
- Reduces energy consumption by providing 100% HVAC utilization of cool supply air
- Allows for higher Delta T’s between the data center cooling air and exhaust air
- Allows for raised thermostat setting, lowering energy consumption and costs
- Allows for Tier IV operation because there are no moving parts that require redundant systems
- Blocks by-pass airflow around equipment, reducing wasted cooling capacity
- Eliminates dependence on close proximity of perforated floor tiles to cabinets by creating a consistent air temperature throughout the room
- Permits chilled water temperatures to be increased, providing means for more economizer days while using the same space
- Mitigating problem cooling areas/hot spots
- Upgrading equipment to higher heat/power densities while using the same space
- Converting an existing space/room/building into a data center (brown field)
- Designing and building a new data center (green field)
Documents for CPI's N-Series TeraFrame® Network Cabinet (for side-to-side airflow and high-density cable management)
- UL Listed The F-Series TeraFrame delivers unprecedented cooling performance in high-density computing applications when deployed with these options:
- Vertical Exhaust Duct
- Airflow Director
- Snap-In Filler Panels
- Air Dam Kit
- Solid Rear Door with Seal
- Vertical Exhaust Duct
These products create a one-way flow of air through the equipment that results in consistently cold air in both the top and bottom of the cabinet. By closing all open spaces, air can no longer recirculate within the cabinet. Cold air enters the cabinet through a perforated front door (or no door), flows through the equipment and is expelled into the drop ceiling via the Vertical Exhaust Duct. Advantages include:
- Supports heat loads of 2-30 kW
- Prevents hot and cold air from mixing within the cabinet
- Prevents hot exhaust air from recirculating over or around cabinet and entering front of equipment
- Delivers uniformly cold intake air temperatures to all equipment when fully implemented across data center
- Maximizes efficiency of air conditioning
- The N-Series TeraFrame Network Cabinet is designed to manage side-to-side airflow in a hot aisle/cold aisle layout with a unique Network Switch Exhaust Duct that converts side-to-side airflow into a front-to-rear airflow pattern. This isolates and re-directs hot air out the back of the cabinet and into the hot aisle, minimizing hot air re-circulation. Thermal choices include:
- Network Switch Exhaust Duct
- Network Switch Exhaust Duct Panel
- Snap-In Filler Panels
- Solid Rear Door
The N-Series TeraFrame Cabinet meets third party specifications for:
- The T-Series SteelFrame Cabinet delivers unprecedented cooling performance in high-density computing applications when deployed with these options:
- Vertical Exhaust Duct
- Airflow Director
- Snap-In Filler Panels
- Air Dam Kit
- Solid Rear Door with Seal
These products create a one-way flow of air through the equipment that results in consistently cold air in both the top and bottom of the cabinet. By closing all open spaces, air can no longer recirculate within the cabinet. Cold air enters the cabinet through a perforated front door (or no door), flows through the equipment and is expelled into the drop ceiling via the Vertical Exhaust Duct. Advantages include:
- Supports high heat densities
- Prevents hot and cold air from mixing within the cabinet
- Prevents hot exhaust air from recirculating over or around cabinet and entering front of equipment
- Delivers uniformly cold intake air temperatures to all equipment when fully implemented across data center
- Maximizes efficiency of air conditioning