{"items":[{"primaryId":"40172-001","Primary ID":"40172-001","Marketing Product Category ":"Bonding & Grounding","Marketing Product Family/Group":"Busbars","Marketing Product Subgroup":"Rack-Mount Busbar","Marketing Product Series":"Vertical Rack Bonding Bar Kit","Marketing Description - Global English":"Vertical Rack Bonding Bar Kit; Includes (1) busbar; (3) #12-24 screws; abrasive pad; joint compound and a ground label; Each","Shipping Weight":3.1,"Shipping Weight Uom":"LB","Ship Height":3,"Ship Height Uom":"in","Ship Length/Depth":211,"Ship Length/Depth Uom":"in","Ship Width":3,"Ship Width Uom":"in","Shipping Weight (Metric)":1.41,"Shipping Weight Uom (Metric)":"kg","Shipping Height (Metric)":8,"Shipping Height Uom (Metric)":"cm","Shipping Width (Metric)":8,"Shipping Width Uom (Metric)":"cm","Msrp $ Usd":190.98,"Country Of Origin":"US","Certifications":["Not Applicable"],"Type":"Rack Ground Tape Kit","Keyword":"flexible ground bar,","Series Level Spec Sheet Link 2":["https://cdn.pimber.ly/public/asset/raw/663b2857ae13c25e14022b2b/ca6ed2b8/66eca4863d2f0d00187f3cf6/40172_CUT-pdf"],"Promote on Website":"1","Attached to Series":"1","Height":"78.65\" (1997.71 mm)","Width":"0.7\" (17 mm)","Pack Of":"EA","BABA Compliant":"1","Product Height":78.7,"Product Height Uom":"\"","Product Width ":0.7,"Product Width Uom":"\"","Product Height (Metric)":1998,"Product Height Uom (Metric)":"mm","Product Width (Metric)":17,"Product Width Uom (Metric)":"mm","Product Weight":0,"Product Weight UOM":"LB","Short Description":"BONDING,TAPE,VERT,.05X.68X78","Search Terms":"40172-001,Vertical Rack Bonding Bar Kit,ZetaFrame Vertical Rack Bonding Bar Kit,Server cabinet Vertical Rack Bonding Bar Kit,Rack-mounted Vertical Rack Bonding Bar Kit,Data center Vertical Rack Bonding Bar Kit,Cabinet Vertical Rack Bonding Bar Kit solution,Network rack Vertical Rack Bonding Bar Kit,Structured cabling solution for Vertical Rack Bonding Bar Kit,Best Vertical Rack Bonding Bar Kit for server racks,How to organize cables with Vertical Rack Bonding Bar Kit,Efficient routing for Vertical Rack Bonding Bar Kit,Front-to-back cable routing for Vertical Rack Bonding Bar Kit,High-density cable organization for Vertical Rack Bonding Bar Kit,Professional cable management for Vertical Rack Bonding Bar Kit","Search Relevancy":1,"SKU Level SEO Page Title":"40172-001 Vertical Rack Bonding Bar Kit - Busbar | Chatsworth","SKU Level SEO Meta Description":"Add a UL‑listed busbar with the 40172-001 Vertical Rack Bonding Bar Kit for secure equipment bonding in 7‑ft racks.","SKU Level Web H4 Heading":"Vertical Rack Busbars - Design and Installation Highlights","SKU Level Web Paragraph Text":"<p>The 40172-001 kit provides a thin, tinned‑copper busbar that aligns with every mounting hole on a standard 7‑ft rack. Its .05‑inch (1.3 mm) thickness and 78.7‑inch height ensure continuous electrical contact for every device. This busbar grounding solution simplifies bonding across the entire rack without additional hardware. Installation requires only three #12‑24 screws, an abrasive pad, and joint compound, all supplied in the kit. The punched‑through holes match the EIA‑310‑E universal pattern, so each equipment bracket touches the busbar directly. Technicians appreciate the quick‑fit design, which reduces install time and minimizes error. UL® Listed under File E236184, the busbar meets Category KDER requirements in the United States and KDER7 in Canada. Compliance guarantees reliable protection against stray currents and static discharge. The included ground label helps maintain clear documentation for auditors and maintenance teams. Because the busbar is a continuous copper strip, it distributes fault currents evenly, enhancing overall system safety. This bonding bar also supports future upgrades, as additional equipment can be added without re‑configuring the grounding scheme. The kit's modular nature fits both new builds and retrofits in hyperscale and multitenant data centers. CPI's Vertical Rack Busbars are engineered for durability in demanding environments, from enterprise networks to AI‑driven HPC clusters. The design integrates seamlessly with existing CPI enclosure families, preserving airflow and thermal performance. Customers benefit from a proven grounding method that protects valuable electronics while meeting industry standards.</p>"}],"options":{},"total":1}