Pedestal Clamp with Bonding Connector
Explore Sizes & Options
| Add to Cart Add | |||
|---|---|---|---|
40169-001 | Cross Connector with Square Style Pedestal | $77.85 | |
40169-002 | Cross Connector with Round Style Pedestal | $236.92 | |
40169-003 | Straight Connector with Square or Round Style Pedestal | $137.20 |
Product Description
Support bonding conductors from round or square raised floor pedestals using the Pedestal Clamp with Bonding Connector. The connector provides a bonding connection for the pedestal and supports up to four bonding conductors (wires) from the pedestal. Use to create a signal reference grid under the raised access floor using #6 AWG or 2/0 bare round conductor. Select the Pedestal Clamp with Bonding Connector to match the style and size of the pedestal and size of the conductor. See the order table.
- Use Cross Connectors to create signal reference grid intersections; support up to (4) conductors, 2 per side, size #6 AWG or 2/0
- Use Straight Connectors to support the signal reference grid in-between intersections; support 1 or 2 conductors on one side of the pedestal only, size #6 AWG or 2/0
- Manufactured from electrotin plated copper or bronze (P/N 40169-003) with stainless steel installation hardware
- PNs 40169-001 and 40169-002 are UL® Listed, File E236184, Category KDER (US), KDER7 (Canada) - Bonding and Grounding Equipment
Product Information
Key Benefits of the Pedestal Clamp with Bonding Connector
The raised floor grounding clamp is engineered to provide a low‑impedance path between a raised floor pedestal and the facility grounding system. By securely attaching to the pedestal, the clamp creates a continuous conductive loop that protects sensitive equipment from stray voltage and electromagnetic interference. CPI's design complies with UL‑listed Category KDER standards, delivering dependable grounding performance in data‑center, hyperscale and enterprise environments. The pedestal clamp variant features a robust body made from electrotin‑plated copper or bronze, offering corrosion resistance and long‑term reliability. It accommodates both round and square pedestal styles, supporting up to four #6 AWG or 2/0 bare conductors, which enables flexible signal‑reference grid configurations. Installation hardware is stainless‑steel, ensuring a secure fit that tolerates vibration and thermal cycling typical of high‑density racks. Ground clamp connector options include cross‑style and straight‑style configurations, allowing designers to tailor the grounding topology to specific layout requirements. Cross connectors provide intersecting points for a comprehensive grid, while straight connectors fill gaps between intersections, each supporting up to two conductors per side. These modular options simplify field assembly and reduce the time required to achieve a fully bonded floor system. In addition to the primary grounding function, the bond clamp design integrates bonding connectors that can be used to tie together multiple grounding points, improving overall system redundancy. The bonding connectors are compatible with standard copper distribution pedestals, facilitating seamless integration with existing infrastructure. This versatility helps meet stringent NEC and IEC grounding codes while supporting future expansion of power‑dense equipment. All components are UL® listed and meet international grounding specifications, giving installers confidence in safety and performance certifications. CPI provides detailed specification sheets and installation guides that outline torque values, conductor sizing, and recommended testing procedures. By choosing the raised floor grounding clamp and pedestal clamp with bonding connector, facilities benefit from a proven, scalable solution that safeguards critical IT assets.