40168-101

The 40168-101 antioxidant joint compound is engineered specifically for copper‑to‑copper grounding applications. Its anti‑oxidant chemistry protects the metal interface from corrosion, extending the service life of critical connections. CPI's rigorous testing ensures consistent performance in demanding data‑center environments. This anti‑oxidant compound for copper creates a conductive bridge that resists oxidation even in high‑humidity or corrosive atmospheres. By sealing the joint, it maintains low‑impedance pathways essential for effective grounding and bonding. Users benefit from reduced maintenance cycles and greater system reliability. Installation of the antioxidant joint compound is straightforward; the paste can be applied with a standard brush or dispenser. The formulation adheres firmly to copper surfaces without requiring additional primers or curing agents. It integrates seamlessly with CPI bonding hardware and enclosure accessories. Compliance with industry standards such as IEEE 1584 and UL‑listed grounding requirements is built into the product design. The copper jointing compound supports both static and dynamic grounding scenarios across enterprise, hyperscale, and edge facilities. Its performance contributes to overall safety and equipment protection. CPI backs the 40168-101 joint compound with global distributor support and technical expertise. Customers can access data sheets, CAD models, and application guidance through the CPI Product Designer tool. This ensures that every installation delivers the intended protection and longevity for critical infrastructure.