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40172-001
Vertical Rack Bonding Bar Kit; Includes (1) busbar; (3) #12-24 screws; abrasive pad; joint compound and a ground label; Each
Product Description
The Rack Bonding Busbar (RBB) Kit includes a thin strip of tinned copper that attaches to the rack’s equipment mounting rail to provide direct bonding contact for rack-mount equipment or a convenient bonding strip. Sized to fit a 7’ (2.1m) high rack with an EIA-310-E Universal hole pattern and 45U, the busbar is punched with a series of holes that align with each mounting hole on the rack. When equipment is mounted to the rack, the rack-mount brackets touch the busbar. Alternately, the Equipment Bonding Jumper Kit can be used to connect equipment to the busbar.
- Each kit includes one ground bar, three #12-24 zinc-plated thread forming hex washer head installation screws, an abrasive pad, joint compound and a ground label
- The ground bar is .05” (1.3 mm) thick tinned copper strip, 78.7”H x .68”W (1997 mm x 17 mm) and is punched with holes that match the EIA-310 universal hole pattern
- UL® Listed Ground Bar, File E236184, Category KDER (US), KDER7 (Canada) - Bonding and Grounding Equipment
Product Information
Vertical Rack Busbars - Design and Installation Highlights
The 40172-001 kit provides a thin, tinned‑copper busbar that aligns with every mounting hole on a standard 7‑ft rack. Its .05‑inch (1.3 mm) thickness and 78.7‑inch height ensure continuous electrical contact for every device. This busbar grounding solution simplifies bonding across the entire rack without additional hardware. Installation requires only three #12‑24 screws, an abrasive pad, and joint compound, all supplied in the kit. The punched‑through holes match the EIA‑310‑E universal pattern, so each equipment bracket touches the busbar directly. Technicians appreciate the quick‑fit design, which reduces install time and minimizes error. UL® Listed under File E236184, the busbar meets Category KDER requirements in the United States and KDER7 in Canada. Compliance guarantees reliable protection against stray currents and static discharge. The included ground label helps maintain clear documentation for auditors and maintenance teams. Because the busbar is a continuous copper strip, it distributes fault currents evenly, enhancing overall system safety. This bonding bar also supports future upgrades, as additional equipment can be added without re‑configuring the grounding scheme. The kit's modular nature fits both new builds and retrofits in hyperscale and multitenant data centers. CPI's Vertical Rack Busbars are engineered for durability in demanding environments, from enterprise networks to AI‑driven HPC clusters. The design integrates seamlessly with existing CPI enclosure families, preserving airflow and thermal performance. Customers benefit from a proven grounding method that protects valuable electronics while meeting industry standards.