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40153-012
PBB Pattern Busbar; 4"H x 12"W x 1/4"D (50 mm x 100 mm x 6.4 mm); Copper
| Width | 12" (305 mm) |
Product Description
ICT Primary Bonding Busbar (PBB) provides a central bond attachment point for ICT bonding backbones, equipment and the building’s ground electrode system.
Hole patterns on Busbars accommodate two-hole lugs per the recommendation of ANSI/BICSI N3-20 and ANSI/TIA-607 standards. Insulators electrically isolate Busbars from the wall or other mounting surfaces, thereby controlling the current path.
Key Features and Benefits
- Mounting brackets are manufactured from high-quality 300 series stainless steel with 3/8” (9.53 mm) diameter mounting holes spaced 5.75” (146.1 mm) apart
- Busbars mount on the wall, floor or ceiling
- Ships preassembled
- Sold individually
- UL Listed, File E236184, Category KDER (US), KDER7 (Canada)
- Busbar assemblies with lug kits also available
- Other configurations available on request
Product Information
Design Tools
Features and Benefits of Primary Bonding Busbars
The BICSI grounding and bonding primary bonding busbar provides a central attachment point for ICT bonding backbones, equipment, and the building's ground electrode system. This copper busbar ensures reliable electrical continuity and safety in data centers and telecommunications rooms. Its design supports compliance with industry standards for effective bonding solutions.
Primary bonding busbars feature hole patterns that accommodate two-hole lugs as recommended by ANSI/BICSI N3-20 and ANSI/TIA-607 standards. These busbars mount on walls, floors, or ceilings with high-quality stainless steel brackets for durable installation. Preassembled units ship individually to simplify deployment and save time during setup.
Bonding busbar assemblies include insulators that electrically isolate the busbar from mounting surfaces, controlling the current path for enhanced safety. UL Listed for the United States and Canada, these busbars meet rigorous testing requirements for performance and reliability. Additional configurations are available on request to tailor solutions to specific project needs.
In applications requiring robust bonding and grounding, such as data centers or edge environments, these busbars help maintain system integrity and reduce electrical hazards. The bonding bus bar design supports efficient connections for telecommunications and power systems. This contributes to overall infrastructure protection and operational continuity.
Chatsworth Products delivers these bonding busbars with decades of expertise in ICT infrastructure solutions. Global availability and rapid customization options ensure you receive tailored support for demanding applications. Trust CPI for high-quality products that power and protect your critical technology investments.