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10610-019
Rack Bonding Busbar; for 19"W (482.6 mm) Rack
| Width | 19" (483 mm) |
Product Description
Use Rack Bonding Busbar for consolidating equipment bonding. Constructed of 3/16”-thick x 3/4”H (4.763 mm x 19.1 mm) hard-drawn electrolytic tough pitch 110 alloy copper bar with eight #6-32 tapped lug mounting holes on 1” (25.4 mm) centers and two pairs of 5/16” (7.938 mm) diameter holes spaced 3/4” (19.1 mm) apart for attaching ground jumpers.
- Other configurations available on request
- UL® Listed
Part number consists of Busbar and a hardware kit that includes:
- (1) splice plate bar, 3”L (80 mm)
- (2) #12-24 copper machine screws
- (2) #12 copper flat washers
- (8) #6-32 copper machine screws
- (8) #6 ring terminals
Product Information
Design Tools
Durable Copper Construction and Mounting Options
The 10610-019 rack bonding busbar delivers a robust rack busbar solution that consolidates equipment grounding across 19" (483 mm) rack enclosures. Its solid 3/16‑inch (4.8 mm) thick, 3/4‑inch (19 mm) high hard‑drawn electrolytic‑tough‑pitch 110 alloy copper provides exceptional conductivity for reliable rack grounding busbar performance. Designed for rapid deployment, the busbar meets UL® Listed standards, giving engineers confidence in safety and compliance. Constructed from premium copper, the busbar features eight #6‑32 tapped lug mounting holes spaced 1 in (25.4 mm) apart, plus two pairs of 5/16‑inch (7.9 mm) holes for attaching ground jumpers. The dimensions support a 19‑inch rack width while maintaining a low profile that preserves valuable rack space. All hardware is engineered for repeatable, torque‑controlled installation, reducing labor time and ensuring consistent electrical continuity. The part number 10610-019 includes a comprehensive hardware kit: a 3‑inch (80 mm) splice plate bar, #12‑24 copper machine screws with flat washers, and eight #6‑32 copper machine screws with ring terminals. This complete kit eliminates the need to source additional components, streamlining the bill of materials for data‑center projects. CPI's product designer tool can generate a fully populated bill of materials, accelerating the design‑to‑procurement workflow. Using this rack bonding busbar improves overall system reliability by providing a low‑impedance path for fault currents, which is essential for rack grounding busbar applications in high‑density environments. The design helps meet regulatory grounding requirements while supporting AI, HPC and liquid‑cooling deployments that demand consistent electrical performance. Customers benefit from reduced electromagnetic interference and enhanced equipment lifespan. CPI supplies downloadable BIM and Visio stencil files so designers can integrate the 10610-019 busbar into CAD and 3‑D models without error. The solution is backed by a global network of authorized distributors, ensuring rapid delivery and local technical support. With CPI's expertise in grounding and bonding, the rack bonding busbar becomes a trusted component for modern data‑center infrastructure.