The Oberon® line of wireless enclosures delivers robust protection for 5G wireless technology deployments in demanding environments. Integrated locking mechanisms and NEMA‑rated seals ensure cellular bonding components remain secure against dust, moisture and accidental tampering. Designed for both indoor and outdoor installations, each enclosure supports rapid deployment of 5G‑ready equipment without sacrificing aesthetic appeal. Thermal management is built into every Oberon® enclosure, using engineered airflow paths that maintain optimal temperatures for high‑density cellular equipment. By balancing heat extraction with low‑profile designs, the solutions reduce cooling costs while preserving performance of small‑cell radios and power modules. Customers benefit from predictable energy use and extended equipment lifespan, aligning with sustainability goals. Power distribution is simplified through eConnect®‑compatible power strips and secure array®‑enabled panels that provide reliable feed to wireless access points. The modular architecture enables easy integration of additional power or monitoring modules as network density grows. This future‑ready approach supports seamless scaling from initial 5G rollouts to expanded CBRS and DAS deployments. Compliance and security are reinforced with electronic locks and tamper‑evident seals that meet industry standards for critical infrastructure. The enclosures also accommodate mounting of cbrs antenna assemblies, ensuring precise alignment for optimal signal propagation. Field technicians appreciate the standardized mounting hardware, which speeds installation and reduces labor expenses. CPI's global engineering team offers consultation services to tailor Oberon® solutions to specific site requirements, from multi‑tenant data centers to edge facilities. Leveraging CPI's rapid product customization, customers receive designs that match exact environmental and regulatory constraints. The result is a resilient, secure wireless infrastructure that maximizes uptime and prepares networks for the next generation of connectivity.